X-RAY, generated by high voltage impingement on the target material, could penetrate most objects. Our inspection engineers, taking use of the feature, use X-ray penetration imaging without damaging the test sample。

Can clearly observe the internal structure of the chip and the solder quality of the various types of SMT joints,thus verify whether there are problems with the components and eliminating the use of inferior and counterfeit components.

The solderability of components, PCB boards, PADS, solders and fluxes are evaluated qualitatively and quantitatively by the principle of wet-balance method.

The weldability of components, PCB boards, PADS, solders and fluxes are evaluated qualitatively and quantitatively by the principle of wet-balance method.

The appearance of the chip is inspected to determine whether there are abnormal phenomena such as cracks and damage.